Patent Assignment
Reel/Frame 013488/0658
Assignment of Assignor's Interest
Recorded: 2002-11-08
Pages: 3
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2002-11-07
RUSLI, SUKIANTO
Executed: 2002-11-08
RAZU, DAVID
Executed: 2002-11-07
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Wafer Level Package and Fabrication Method
Patent:
6,905,914 →
Application:
10/291,050 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →