Patent Assignment
Reel/Frame 013622/0959
Assignment of Assignor's Interest
Recorded: 2003-05-02
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(3)
Resist resins, chemically amplified resist composition, and process for the formation of a pattern
Application:
09/991,691 →
Publication:
US 2002/0098442
Manufacturing Method of a Semiconductor Device
Semiconductor device with thin film having high permittivity and uniform thickness
Application:
10/125,370 →
Publication:
US 2002/0153579
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 26, 2001
From: YAMANA, MITSUHARU
To: NEC CORPORATION
Reel/Frame 012324/0252 →
Assignment of Assignor's Interest
Dec 7, 2001
From: UENO, KAZUYOSHI
To: NEC CORPORATION
Reel/Frame 012362/0377 →
Assignment of Assignor's Interest
Apr 19, 2002
From: YAMAMOTO, ICHIRO
To: NEC CORPORATION
Reel/Frame 012832/0574 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0592 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →