IP Library › Assignment 013660/0843
Patent Assignment
Reel/Frame 013660/0843

Assignment of Assignor's Interest

Recorded: 2003-01-14 Pages: 2
Assignors
TSAI, CHUNG-CHE
Executed: 2002-08-19
SHAN, WEI-HENG
Executed: 2002-08-19
Assignee
UNITED TEST CENTER INC.
NO. 2, LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK, HSIN CHU, R.O.C., TAIWAN
Covered Property (1)
Stacked Chip Package with Enhanced Thermal Conductivity
Patent: 6,713,856 →
Application: 10/232,729 →
Publication: US 2004/0041249
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 8, 2004
From: UNITED TEST CENTER, INC.
To: ULTRATERA CORPORATION
Reel/Frame 014849/0405 →
Change of Name Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest Dec 22, 2017
From: UTAC (TAIWAN) CORPORATION
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044467/0697 →