Patent Assignment
Reel/Frame 014849/0405
Change of Name
Recorded: 2004-01-08
Pages: 4
Assignor
UNITED TEST CENTER, INC.
Executed: 2002-03-19
Assignee
ULTRATERA CORPORATION
NO. 2, LI HSIN 3RD RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Stacked Chip Package with Enhanced Thermal Conductivity
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2003
From: TSAI, CHUNG-CHE; SHAN, WEI-HENG
To: UNITED TEST CENTER INC.
Reel/Frame 013660/0843 →
Change of Name
Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest
Dec 22, 2017
From: UTAC (TAIWAN) CORPORATION
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044467/0697 →