IP Library › Assignment 013681/0337
Patent Assignment
Reel/Frame 013681/0337

Assignment of Assignor's Interest

Recorded: 2003-05-27 Pages: 3
Assignors
ONO, TAKAO
Executed: 2003-01-17
IWABUCHI, MITSURU
Executed: 2003-01-17
FUJIMORI, KENJI
Executed: 2003-01-17
Assignee
TAMURA KAKEN CORPORATION
16-2, OAZA SAYAMAGAHARA IRUMA-SHI, SAITAMA, 358-8501, JAPAN
Covered Property (1)
Lead-Free Solder, and Paste Solder Composition
Patent: 6,726,780 →
Application: 10/384,829 →
Publication: US 2003/0178101
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 16, 2003
From: ONO, TAKAO; IWABUCHI, MITSURU; FUJIMORI, KENJI; KOYAHARA, HIROAKI
To: TAMURA KAKEN CORPORATION
Reel/Frame 014176/0519 →
Merger Sep 20, 2011
From: TAMURAKAKEN CORPORATION
To: TAMURA CORPORATION
Reel/Frame 026934/0215 →