IP Library › Assignment 026934/0215
Patent Assignment
Reel/Frame 026934/0215

Merger

Recorded: 2011-09-20 Pages: 18
Assignor
TAMURAKAKEN CORPORATION
Executed: 2010-04-01
Assignee
TAMURA CORPORATION
1-19-43, HIGASHI-OIZUMI, NERIMA-KU, TOKYO, 178-8511, JAPAN
Covered Properties (2)
Water-Soluble Preflux, Printed Circuit Board, and Process for Treating the Surface of a Metal in a Printed Circuit Board
Patent: 6,712,262 →
Application: 10/197,764 →
Publication: US 2003/0141351
Lead-Free Solder, and Paste Solder Composition
Patent: 6,726,780 →
Application: 10/384,829 →
Publication: US 2003/0178101
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 27, 2003
From: ONO, TAKAO; IWABUCHI, MITSURU; FUJIMORI, KENJI
To: TAMURA KAKEN CORPORATION
Reel/Frame 013681/0337 →
Assignment of Assignor's Interest Jun 16, 2003
From: ONO, TAKAO; IWABUCHI, MITSURU; FUJIMORI, KENJI; KOYAHARA, HIROAKI
To: TAMURA KAKEN CORPORATION
Reel/Frame 014176/0519 →
Assignment of Assignor's Interest Nov 6, 2003
From: AKAIKE, SHINICHI; NAKANAMI, KAZUTAKA; TAKAHASHI, YOSHIYUKI; ONO, TAKAO
To: TAMURAKAKEN CORPORATION
Reel/Frame 014111/0190 →