Patent Assignment
Reel/Frame 013738/0275
Assignment of Assignor's Interest
Recorded: 2003-02-10
Pages: 5
Assignors
FRANKOWSKY, GERD
Executed: 2002-11-11
HEDLER, HARRY
Executed: 2002-11-25
IRSIGLER, ROLAND
Executed: 2002-11-11
MEYER, THORSTEN
Executed: 2002-12-09
VASQUEZ, BARBARA
Executed: 2002-11-22
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, 81669 MUNICH, GERMANY
Covered Property
(1)
Method for Producing an Electronic Component Having a Plurality of Chips That Are Stacked One Above the Other and Contact-Connected to One Another
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0457 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Oct 7, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036808/0284 →