IP Library › Assignment 013758/0595
Patent Assignment
Reel/Frame 013758/0595

Assignment of Assignor's Interest

Recorded: 2003-02-06 Received: 2003-02-12 Pages: 20
Assignor
NEC CORPORATION
Executed: 2003-01-10
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties (18)
Burn-in apparatus and semiconductor wafer
Application: 10/212,786 →
Method for Testing Semiconductor Integrated Circuit Device Equipped with Power Make-Up Circuit Used in Burn-in Test
Application: 09/984,843 →
Side Wall Contact Structure and Method of Forming the Same
Application: 09/939,605 →
Semiconductor Memory Device and Method for Accessing Memory Cell
Application: 09/911,120 →
Synchronous Semiconductor Memory Device
Application: 09/864,243 →
Semiconductor Memory That Enables High Speed Operation
Application: 09/863,322 →
Semiconductor Memory Device
Application: 09/846,252 →
Semiconductor Memory Device Having a Test Mode Decision Circuit
Application: 09/839,504 →
Memory device with booting circuit capable of pre-booting before wordline selection
Application: 09/834,402 →
Semiconductor Memory and Method of Saving Energy of the Memory
Application: 09/819,352 →
Method of Manufacturing Semiconductor Device
Application: 09/817,662 →
Semiconductor device manufacturing system and method of manufacturing semiconductor devices
Application: 09/814,871 →
Socket Used for Semiconductor Device and Testing System Connected to Socket Through Dual-Transmission Lines
Application: 09/815,550 →
Semiconductor Storage Device
Application: 09/813,684 →
Delay Circuit
Application: 09/800,025 →
Semiconductor Memory Having Parallel Test Mode
Application: 09/781,054 →
Semiconductor Memory Device
Application: 09/764,481 →
Semiconductor Capacitor Device
Application: 09/755,862 →