Patent Assignment
Reel/Frame 013760/0821
Assignment of Assignor's Interest
Recorded: 2003-02-19
Received: 2003-02-21
Pages: 5
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(29)
Level Shift Circuit
Application:
10/245,091 →
Charge Pump Current Compensating Circuit
Application:
10/237,946 →
Scan Flip-Flop and Semiconductor Integrated Circuit Device
Application:
10/234,612 →
Tone ordering circuit and tone ordering method for an xDSL
Application:
10/227,721 →
Flip-Flop Circuit
Application:
10/210,748 →
Semiconductor Device and Wire Bonding Method Therefor
Application:
10/194,142 →
Voltage Amplifying Circuit
Application:
10/189,140 →
Semiconductor Integrated Circuit
Application:
10/189,261 →
Write Protect Method
Application:
10/180,876 →
Data storing circuit and data processing apparatus
Application:
10/174,154 →
Cache Memory Control Apparaus and Processor
Application:
10/166,131 →
Non-Volatile Storage Device and Rewrite Control Method Thereof
Application:
10/164,657 →
Circuit for Transferring a Timing Signal Between Circuits Having Diffferent Clock Frequencies
Application:
10/156,209 →
Semiconductor integrated circuit
Application:
10/156,567 →
Scan path test method
Application:
10/153,014 →
Non-Volatile Semiconductor Memory
Application:
10/139,716 →
Differential Amplifying Circuit and Multi-Stage Differential Amplifying Circuit Using the Same
Application:
10/127,877 →
Scan Test Circuit Including a Control Test Mode
Application:
10/127,959 →
Method for Writing Data into a Semiconductor Memory Device and Semiconductor Memory Therefor
Application:
10/113,192 →
Method of Forming a Trench Isolation Structure and Semiconductor Device
Application:
10/106,161 →
Semiconductor Device
Application:
10/074,138 →
Semiconductor Level Shifter Circuit
Application:
10/054,085 →
Semiconductor Memory Device with Redundancy and/or Defect Test Capability
Application:
10/027,461 →
Semiconductor Device and Its Manufacturing Method
Application:
10/032,764 →
Semiconductor Device Having a Reduced Leakage Current
Application:
09/971,158 →
Semiconductor Device Having High Speed Signal Capability and Manufacturing Process Therefor
Application:
09/917,319 →
Semiconductor Memory Device
Application:
09/872,291 →
Semiconductor Memory Apparatus and Method for Outputting Data
Application:
09/835,609 →
Semiconductor Device and Fabrication Method
Application:
09/835,958 →