Patent Assignment
Reel/Frame 013780/0009
Assignment of Assignor's Interest
Recorded: 2003-02-19
Pages: 2
Assignors
FURUKAWA, RYOUICHI
Executed: 2000-04-14
SUKO, KAZUYUKI
Executed: 2000-04-14
HIRANUMA, MASAYUKI
Executed: 2000-05-22
SAITOH, KOICHI
Executed: 2000-04-14
YAMAMOTO, HIROHIKO
Executed: 2000-04-14
YOSHIDA, TADANORI
Executed: 2000-04-14
ISHIZAKA, MASAYUKI
Executed: 2000-04-14
SHIMODA, MAKI
Executed: 2000-04-14
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI ULSI SYSTEMS CO. LTD
22-1 JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Property
(1)
Method of Forming Conductive Layers in the Trenches or Through Holes Made in an Insulating Film on a Semiconductor Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014568/0160 →
Merger
Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024982/0148 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →