Assignment of Assignor's Interest

Recorded: 2003-07-17 Received: 2003-07-17 Pages: 10

Assignor

NEC CORPORATION

Executed: 2002-11-01

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN

Covered Properties (9)

Cmos Output Circuit

Application: 10/156,833 →

Flip chip type semiconductor device and method for manufacturing the same

Application: 10/131,486 →

Method of Fabricating a Semiconductor Device by Filling Gaps Between Gate Electrodes with Hsq

Application: 09/977,386 →

Semiconductor Device with Semiconductor Chip on Flexible Tape

Application: 09/878,197 →

Method of Fabricating Semiconductor Device Having Ferroelectric Capacitor

Application: 09/838,186 →

Optical Semiconductor Device and Method of Manufactoring the Same

Application: 09/832,842 →

Resist Pattern Forming Method and Semiconductor Device Manufacturing Method

Application: 09/826,006 →

Circuit Design Method for Designing Conductive Members with a Multilayered Structure to Have Antenna Sized of Proper Values

Application: 09/825,331 →

Structure and Manufacturing Method of Non-Volatile Flash Memory

Application: 09/761,693 →