Patent Assignment
Reel/Frame 013895/0393
Assignment of Assignor's Interest
Recorded: 2003-03-19
Pages: 3
Assignors
HINER, DAVID JON
Executed: 2003-03-07
HUEMOELLER, RONALD PATRICK
Executed: 2003-03-07
RUSLI, SUKIANTO
Executed: 2003-03-07
Assignee
AMKOR TECHNOLOGY INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(3)
Integrated Circuit Substrate Having Laser-Embedded Conductive Patterns and Method Therefor
Patent:
6,930,256 →
Application:
10/138,225 →
Integrated circuit film substrate having embedded conductive patterns and vias
Application:
10/261,868 →
Integrated circuit substrate having embedded back-side access conductors and vias
Application:
10/392,737 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2002
From: HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 012867/0785 →
Assignment of Assignor's Interest
Oct 1, 2002
From: HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO; HINER, DAVID
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013357/0284 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →