Patent Assignment
Reel/Frame 013898/0857
Assignment of Assignor's Interest
Recorded: 2003-03-20
Pages: 3
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Device for Measuring Temperature of Semiconductor Integrated Circuit
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.