Patent Assignment
Reel/Frame 013902/0864
Assignment of Assignor's Interest
Recorded: 2003-03-19
Pages: 3
Assignors
HINER, DAVID JON
Executed: 2003-03-07
HUEMOELLER, RONALD PATRICK
Executed: 2003-03-07
RUSLI, SUKIANTO
Executed: 2003-03-07
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Integrated Circuit Substrate Having Laminated Laser-Embedded Circuit Layers
Patent:
6,930,257 →
Application:
10/392,738 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →