Patent Assignment
Reel/Frame 013904/0981
Assignment of Assignor's Interest
Recorded: 2003-03-31
Pages: 2
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Properties
(6)
Failure Analysis System of Semiconductor Memory Device
Patent:
6,871,168 →
Application:
09/570,863 →
Package having terminated plating layer and its manufacturing method
Application:
10/226,258 →
Publication:
US 2002/0190376
Method of Measuring Optical Aberration
Cleaning Method, Method for Fabricating Semiconductor Device and Cleaning Solution
Semiconductor device and method of manufacturing the same
Application:
10/303,715 →
Publication:
US 2003/0170993
Alignment Pattern for a Semiconductor Device Manufacturing Process
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2000
From: TANAKA, MIKIO; SUGIMOTO, MASAAKI; HAMADA, TAKEHIKO
To: NEC CORPORATION
Reel/Frame 010794/0826 →
Assignment of Assignor's Interest
Oct 31, 2002
From: AOKI, HIDEMITSU; TOMIMORI, HIROAKI; YAMAMOTO, KENICHI
To: NEC CORPORATION
Reel/Frame 013472/0345 →
Assignment of Assignor's Interest
Dec 2, 2002
From: TERAMOTO, CHIERI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013538/0631 →
Assignment of Assignor's Interest
Apr 25, 2003
From: NAGAHARA, SEIJI; SHIBA, KAZUTOSHI; HAMANAKA, NOBUAKI; USAMI, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013601/0618 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0959 →
Change of Name
Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0163 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →