Patent Assignment
Reel/Frame 013944/0470
Assignment of Assignor's Interest
Recorded: 2003-04-02
Pages: 3
Assignee
LATTICE SEMICONDUCTOR CORPORATION
5555 N.E. MOORE COURT, HILLSBORO, OREGON
Covered Property
(1)
Hierarchical General Interconnect Architecture for High Density Fpga's
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 24, 2015
From: LATTICE SEMICONDUCTOR CORPORATION; SIBEAM, INC.; SILICON IMAGE, INC.; DVDO, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 035308/0428 →
Security Interest
May 21, 2019
From: LATTICE SEMICONDUCTOR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 049980/0786 →
Release of Security Interest
May 21, 2019
From: JEFFERIES FINANCE LLC
To: LATTICE SEMICONDUCTOR CORPORATION; SILICON IMAGE, INC.; SIBEAM, INC.; DVDO, INC.
Reel/Frame 049827/0326 →