Patent Assignment
Reel/Frame 014034/0958
Assignment of Assignor's Interest
Recorded: 2003-05-01
Pages: 3
Assignors
YANG, JUN YOUNG
Executed: 2003-04-29
LEE, SUN GOO
Executed: 2003-04-29
LEE, CHOON HEUNG
Executed: 2003-04-29
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Semiconductor Package Including Low Temperature Co-Fired Ceramic Substrate
Patent:
6,879,034 →
Application:
10/427,118 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →