Patent Assignment
Reel/Frame 014091/0142
Assignment of Assignor's Interest
Recorded: 2003-05-15
Pages: 2
Assignor
YU, HO-YUAN
Executed: 2003-05-15
Assignee
LOVOLTECH, INC.
3970 FREEDOM CIRCLE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method and Structure for Composite Trench Fill
Patent:
6,887,768 →
Application:
10/439,558 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 8, 2006
From: LOVOLTECH INC.
To: QSPEED SEMICONDUCTOR INC.
Reel/Frame 018597/0920 →
Merger
Dec 12, 2006
From: QSPEED SEMICONDUCTOR INC.
To: QSPEED SEMICONDUCTOR INC.
Reel/Frame 018616/0298 →
Security Agreement
Feb 6, 2007
From: QSPEED SEMICONDUCTOR, INC.
To: SILICON VALLEY BANK
Reel/Frame 018855/0591 →
Release
May 22, 2009
From: SILICON VALLEY BANK
To: QSPEED SEMICONDUCTOR INC.
Reel/Frame 022732/0220 →
Assignment of Assignor's Interest
Mar 14, 2011
From: QSPEED SEMICONDUCTOR, INC
To: POWER INTEGRATIONS, INC.
Reel/Frame 025949/0001 →