Assignment of Assignor's Interest

Recorded: 2003-06-02 Pages: 3

Assignor

KYE, JIHONG

Executed: 2003-03-24

Assignee

DOW GLOBAL TECHNOLOGIES, INC.

WASHINGTON STREET, 1790 BUILDING, MIDLAND, MICHIGAN, 48674

Covered Property (1)

Two-Component Epoxy Adhesive Formulation for High Elongation with Low Modulus

Patent: 7,157,143 →

Application: 10/395,783 →

Publication: US 2004/0197563

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.