Change of Name

Recorded: 2017-07-27 Pages: 5

Assignor

DOW GLOBAL TECHNOLOGIES INC.

Executed: 2010-12-31

Assignee

DOW GLOBAL TECHNOLOGIES LLC

2040 DOW CENTER, MIDLAND, MICHIGAN, 48674

Covered Property (1)

Two-Component Epoxy Adhesive Formulation for High Elongation with Low Modulus

Patent: 7,157,143 →

Application: 10/395,783 →

Publication: US 2004/0197563

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.