Patent Assignment
Reel/Frame 014139/0172
Assignment of Assignor's Interest
Recorded: 2003-05-29
Pages: 3
Assignors
HSIUNG, CHIUNG-SHENG
Executed: 2003-05-12
YANG, CHIH-CHAO
Executed: 2003-05-12
YANG, GWO-SHIL
Executed: 2003-05-12
YEH, MING-SHIH
Executed: 2003-05-12
CHEN, JEN-KON
Executed: 2003-05-12
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Interconnection Structure and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.