Patent Assignment
Reel/Frame 014183/0408
Assignment of Assignor's Interest
Recorded: 2003-06-16
Pages: 4
Assignors
MOK, SWEE M.
Executed: 2003-06-04
DANVIR, JANICE M.
Executed: 2003-06-05
WU, CHI-HAUR
Executed: 2003-06-12
Assignee
MOTOROLA INC.
1303 EAST ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196-1079
Covered Property
(1)
Heated Nozzle Assembly
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
Assignment of Assignor's Interest
May 13, 2005
From: MOK, SWEE M.; DANVIR, JANICE M.; WU, CHI-HUAR
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 016557/0757 →
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Security Agreement
May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →