Patent Assignment
Reel/Frame 016557/0757
Assignment of Assignor's Interest
Recorded: 2005-05-13
Pages: 4
Assignors
MOK, SWEE M.
Executed: 2003-06-05
DANVIR, JANICE M.
Executed: 2003-06-12
WU, CHI-HUAR
Executed: 2003-06-04
Assignee
FREESCALE SEMICONDUCTOR, INC.
LAW DEPARTMENT, 7700 WEST PARMER LANE, AUSTIN, TEXAS, 78729
Covered Property
(1)
Heated Nozzle Assembly
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 16, 2003
From: MOK, SWEE M.; DANVIR, JANICE M.; WU, CHI-HAUR
To: MOTOROLA INC.
Reel/Frame 014183/0408 →
Assignment of Assignor's Interest
May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Security Agreement
May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →