Patent Assignment
Reel/Frame 014388/0490
Assignment of Assignor's Interest
Recorded: 2004-03-01
Pages: 4
Assignors
ARARAO, VIRGIL COTOCO
Executed: 2003-11-18
SHIM, IL KWON
Executed: 2003-11-18
CHOW, SENG GUAN
Executed: 2003-11-18
ALVAREZ, SHEILA MARIE L.
Executed: 2003-11-18
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Fabrication Method for Semiconductor Package Heat Spreaders
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Change of Name
May 30, 2024
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 067568/0680 →
Change of Name
May 30, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067568/0682 →