Patent Assignment
Reel/Frame 067568/0680
Change of Name
Recorded: 2024-05-30
Pages: 2
Assignor
ST ASSEMBLY TEST SERVICES LTD.
Executed: 2004-06-08
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Fabrication Method for Semiconductor Package Heat Spreaders
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2004
From: ARARAO, VIRGIL COTOCO; SHIM, IL KWON; CHOW, SENG GUAN; ALVAREZ, SHEILA MARIE L.
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 014388/0490 →
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Change of Name
May 30, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067568/0682 →