Patent Assignment
Reel/Frame 014393/0552
Assignment of Assignor's Interest
Recorded: 2003-08-18
Pages: 3
Assignor
LEE, YONG GUEN
Executed: 2003-07-23
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GAGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Rf Semiconductor Devices and Methods for Fabricating the Same
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name
May 30, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017703/0499 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017703 Frame 0499. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 28, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017854/0297 →
Merger
Apr 22, 2015
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 035469/0801 →
Assignment of Assignor's Interest
Apr 24, 2015
From: DONGBU HITEK CO., LTD.
To: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
Reel/Frame 035491/0744 →
Assignment of Assignor's Interest
May 12, 2015
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035620/0771 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →