Patent Assignment
Reel/Frame 014478/0407
Assignment of Assignor's Interest
Recorded: 2004-03-30
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2004-02-02
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(6)
Semiconductor Integrated Circuit Device and Manufacturing Method of Semiconductor Integrated Circuit Device
Data Communication Method and Data Communication Device and Semiconductor Device
Semiconductor Device, Manufacturing Thereof and Power Amplifier Module
Manufacturing Method of Polymetal Gate Electrode
Semiconductor Integrated Circuit Device and Process for Producing the Same
Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 9, 2003
From: OHBU, ISAO; TANOUE, TOMONORI; KUSANO, CHUSHIRO; UMEMOTO, YASUNARI
To: HITACHI, LTD.
Reel/Frame 013955/0405 →
Assignment of Assignor's Interest
Aug 20, 2003
From: YAMAMOTO, NAOKI; TANABE, YOSHIKAZU; KOGAYU, HIROSHIGE; YOSHIDA, TAKEHIKO
To: HITACHI, LTD.
Reel/Frame 014585/0233 →
Assignment of Assignor's Interest
Aug 20, 2003
From: YAMAMOTO, NAOKI; UCHIYAMA, HIROYUKI; SUZUKI, NORIO; NISHITANI, EISUKE
To: HITACHI, LTD.
Reel/Frame 014606/0813 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →