IP Library › Assignment 014547/0577
Patent Assignment
Reel/Frame 014547/0577

Assignment of Assignor's Interest

Recorded: 2003-09-24 Pages: 5
Assignors
TZU, CHUNG-HSING
Executed: 2003-09-03
SHIH, JUNG-CHUN
Executed: 2003-08-28
CHEN, KUANG-YANG
Executed: 2003-09-16
TAN, KUO-CHANG
Executed: 2003-09-07
HO, HSI-HSUN
Executed: 2003-08-28
LIAO, JUNE-WEN
Executed: 2003-09-16
WANG, CHING-HUAI
Executed: 2003-09-17
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE RD., CHANDLER, ARIZONA, 85248
Covered Property (1)
Reinforced Die Pad Support Structure
Patent: 6,921,967 →
Application: 10/669,820 →
Publication: US 2005/0062139
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →