Patent Assignment
Reel/Frame 014561/0233
Assignment of Assignor's Interest
Recorded: 2003-09-26
Pages: 3
Assignors
PARK, SUNG SOON
Executed: 2003-09-26
JANG, SANG JAE
Executed: 2003-09-26
LEE, CHOON HEUNG
Executed: 2003-09-26
LEE, SEON GOO
Executed: 2003-09-26
SOHN, EUN SOOK
Executed: 2003-09-26
PARK, SUNG SU
Executed: 2003-09-26
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Semiconductor Package Structure Reducing Warpage and Manufacturing Method Thereof
Patent:
6,936,922 →
Application:
10/672,886 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →