Patent Assignment
Reel/Frame 014695/0456
Assignment of Assignor's Interest
Recorded: 2003-11-14
Pages: 3
Assignor
NEC CORPORATION
Executed: 2003-11-12
Assignee
NEC ELECTRONIC CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property
(1)
Method for Forming a Semiconductor Device That Uses a Low Resistance Tungsten Silicide Layer with a Strong Adherence to an Underlayer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.