IP Library › Assignment 014739/0662
Patent Assignment
Reel/Frame 014739/0662

Assignment of Assignor's Interest

Recorded: 2003-12-01 Pages: 3
Assignor
KO, SANGTAE
Executed: 2003-11-24
Assignee
DONGBU ELECTRONICS CO., LTD
891-10 DAECHI-DONG, GANGNAM-GU, KOREA, REPUBLIC OF
Covered Property (1)
Method and Apparatus for Forming a Barrier Metal Layer in Semiconductor Devices
Patent: 7,253,110 →
Application: 10/701,341 →
Publication: US 2004/0132284
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →