IP Library › Assignment 014752/0116
Patent Assignment
Reel/Frame 014752/0116

Assignment of Assignor's Interest

Recorded: 2003-12-05 Pages: 3
Assignor
LEE, JAE SUK
Executed: 2003-11-24
Assignee
DONGBU ELECTRONICS CO., LTD. (A KOREAN CORPORATION)
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Methods to Reduce Stress on a Metal Interconnect
Patent: 6,949,475 →
Application: 10/694,035 →
Publication: US 2004/0135260
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →