Patent Assignment
Reel/Frame 014758/0425
Assignment of Assignor's Interest
Recorded: 2003-11-25
Pages: 2
Assignor
LEE, DATE-GUN
Executed: 2003-11-11
Assignee
ANAM SEMICONDUCTOR, INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Pad of a Semiconductor Device and Formation Method Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 11, 2005
From: ANAM SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016504/0609 →
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →