IP Library › Assignment 016504/0609
Patent Assignment
Reel/Frame 016504/0609

Change of Name

Recorded: 2005-07-11 Pages: 5
Assignor
ANAM SEMICONDUCTOR INC.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (3)
Method of Forming Trench in Semiconductor Device Using Polish Stop Layer and Anti-Reflection Coating
Patent: 7,294,555 →
Application: 10/722,295 →
Publication: US 2004/0121552
Bonding Pad of a Semiconductor Device and Formation Method Thereof
Patent: 6,995,082 →
Application: 10/722,299 →
Publication: US 2004/0115942
Method for Manufacturing Silicide and Semiconductor with the Silicide
Patent: 7,220,623 →
Application: 10/751,172 →
Publication: US 2004/0201066
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 25, 2003
From: SEO, YOUNG-HUN
To: ANAM SEMICONDUCTOR, INC.
Reel/Frame 014752/0180 →
Assignment of Assignor's Interest Nov 25, 2003
From: LEE, DATE-GUN
To: ANAM SEMICONDUCTOR, INC.
Reel/Frame 014758/0425 →
Assignment of Assignor's Interest Dec 30, 2003
From: HAN, JAE-WON
To: ANAM SEMICONDUCTOR INC.
Reel/Frame 014870/0105 →
Change of Name Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →