Patent Assignment
Reel/Frame 014777/0438
Assignment of Assignor's Interest
Recorded: 2003-12-05
Pages: 2
Assignor
LEE, KANG-HYUN
Executed: 2003-11-30
Assignee
DONGBU ELECTRONICS CO., LTD.
838, YEOKSAM 1-DONG, KANGNAM-KU, SEOUL, 135-080, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Metal Line of Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 31, 2005
From: DONGBU ELECTRONICS CO., LTD
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016292/0146 →
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →