IP Library › Assignment 016292/0146
Patent Assignment
Reel/Frame 016292/0146

Merger

Recorded: 2005-05-31 Pages: 11
Assignor
DONGBU ELECTRONICS CO., LTD
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (9)
Method for Fabricating Metal Line of Semiconductor Device
Patent: 7,585,774 →
Application: 10/728,706 →
Publication: US 2004/0121580
Semiconductor Device Having Void Free Contact and Method for Fabricating the Contact
Patent: 7,041,597 →
Application: 10/893,618 →
Publication: US 2005/0014358
Method for Fabricating a Semiconductor Device Having Salicide
Patent: 7,033,932 →
Application: 10/919,954 →
Publication: US 2005/0048750
Semiconductior Device Having Improved Contact Hole Structure and Method for Fabricating the Same
Patent: 6,987,060 →
Application: 10/935,026 →
Publication: US 2005/0140017
Method for Fabricating a Semiconductor Device Having Self Aligned Source (Sas) Crossing Trench
Patent: 7,074,682 →
Application: 10/951,503 →
Publication: US 2005/0074925
Exposure Apparatus and Method for Forming Fine Patterns of Semiconductor Device Using the Same
Patent: 7,318,997 →
Application: 10/951,828 →
Publication: US 2005/0074703
Cmos Image Sensor and Manufacturing Method Thereof
Patent: 7,129,108 →
Application: 10/956,202 →
Publication: US 2005/0082627
Cmos Image Sensor with Dark Current Reduction
Patent: 7,397,076 →
Application: 10/971,590 →
Publication: US 2005/0087783
Flash Memory Cell and Method for Manufacturing the Same
Patent: 7,061,045 →
Application: 10/992,989 →
Publication: US 2005/0142743
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2003
From: LEE, KANG-HYUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014777/0438 →
Assignment of Assignor's Interest Sep 27, 2004
From: KIM, HYUNG-WON; BAEK, SEUNG-WON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015858/0501 →
Assignment of Assignor's Interest Sep 27, 2004
From: KIM, JUM SOO; JUNG, SUNG MUN
To: DONGBU ELECTRONCIS CO., LTD.
Reel/Frame 015848/0121 →
Assignment of Assignor's Interest Sep 30, 2004
From: JANG, HOON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015871/0372 →
Assignment of Assignor's Interest Oct 22, 2004
From: JANG, HOON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015924/0688 →
Assignment of Assignor's Interest Nov 18, 2004
From: JUNG, MYUNG-JIN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 016013/0259 →
Change of Name Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Merger Apr 22, 2015
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 035469/0801 →
Assignment of Assignor's Interest Apr 24, 2015
From: DONGBU HITEK CO., LTD.
To: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
Reel/Frame 035491/0744 →
Assignment of Assignor's Interest May 12, 2015
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035620/0771 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041377/0271 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →