Security Agreement

Recorded: 2004-07-14 Received: 2004-07-14 Pages: 14

Assignor

BLUE29 CORPORATION

Executed: 2004-07-09

Assignee

KT VENTURE GROUP, L.L.C.

160 RIO ROBLES, SAN JOSE, CA, 95134-1809, UNITED STATES

Covered Properties (17)

Universal Substrate Holder for Treating Objects in Fluids

PCT: PCTUS2004005214 ↗

Multi-staged heating system for fabricating microelectronic devices

Application: 10/624,397 →

Methods and System for Processing a Microelectronic Topography

Application: 10/462,167 →

Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers

Application: 10/462,343 →

Microelectronic Fabrication System Components and Method for Processing a Wafer Using Such Components

Application: 10/462,180 →

Use of new bleach activators in dishwashing detergents

Application: 10/343,613 →

Method for Electroless Deposition of Phosphorus-Containing Metal Films Onto Copper with Palladium-Free Activation

Application: 10/345,134 →

Activation-Free Electroless Solution for Deposition of Cobalt and Method for Deposition of Cobalt Capping/Passivation Layer on Copper

Application: 10/379,692 →

Universal Substrate Holder for Treating Objects in Fluids

Application: 10/369,878 →

Solution Composition and Method for Electroless Deposition of Coatings Free of Alkali Metals

Application: 10/339,260 →

Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth

Application: 10/299,070 →

Spatially-Arranged Chemical Processing Station

Application: 10/299,069 →

Method and apparatus for uniform treatment of objects in liquids

Application: 10/299,074 →

Temperature-Controlled Substrate Holder for Processing in Fluids

Application: 10/247,895 →

Method and Apparatus for Electroless Deposition with Temperature-Controlled Chuck

Application: 10/242,331 →

Alkaline metal-free solution for electroless deposition of Co(W,P) barrier/capping layer for interconnect applications

Application: 60/401,948 →

Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates

Application: 10/103,015 →