IP Library › Patent Application 60401948
Patent Application Provisional Small
App. No. 60/401,948 · Confirmation No. 4022

Alkaline metal-free solution for electroless deposition of Co(W,P) barrier/capping layer for interconnect applications

Provisional Application Expired
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 Code Description Pages PDF
2002-08-08 TRNA Transmittal of New Application 1 View
2002-08-08 ADS Application Data Sheet 1 View
2002-08-08 SPEC Specification 7 View
2002-08-08 CLM Claims 2 View
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Quick Facts
App. No.
60/401,948
Filed
2002-08-08