Patent Assignment
Reel/Frame 015241/0053
Termination and Release of Intellectual Property Security
Recorded: 2004-10-08
Received: 2004-10-08
Pages: 8
Assignor
KT VENTURE GROUP, L.L.C.
Executed: 2004-10-07
Assignee
BLUE29 CORPORATION
615 PALOMAR AVENUE, SUNNYVALE, CA, 94085, UNITED STATES
Covered Properties
(16)
Universal Substrate Holder for Treating Objects in Fluids
PCT:
PCTUS2004005214 ↗
Multi-staged heating system for fabricating microelectronic devices
Application:
10/624,397 →
Methods and System for Processing a Microelectronic Topography
Application:
10/462,167 →
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
Application:
10/462,343 →
Microelectronic Fabrication System Components and Method for Processing a Wafer Using Such Components
Application:
10/462,180 →
Method for Electroless Deposition of Phosphorus-Containing Metal Films Onto Copper with Palladium-Free Activation
Application:
10/345,134 →
Activation-Free Electroless Solution for Deposition of Cobalt and Method for Deposition of Cobalt Capping/Passivation Layer on Copper
Application:
10/379,692 →
Universal Substrate Holder for Treating Objects in Fluids
Application:
10/369,878 →
Solution Composition and Method for Electroless Deposition of Coatings Free of Alkali Metals
Application:
10/339,260 →
Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
Application:
10/299,070 →
Spatially-Arranged Chemical Processing Station
Application:
10/299,069 →
Method and apparatus for uniform treatment of objects in liquids
Application:
10/299,074 →
Temperature-Controlled Substrate Holder for Processing in Fluids
Application:
10/247,895 →
Method and Apparatus for Electroless Deposition with Temperature-Controlled Chuck
Application:
10/242,331 →
Alkaline metal-free solution for electroless deposition of Co(W,P) barrier/capping layer for interconnect applications
Application:
60/401,948 →
Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates
Application:
10/103,015 →