IP Library Assignment 015241/0053
Patent Assignment
Reel/Frame 015241/0053

Termination and Release of Intellectual Property Security

Recorded: 2004-10-08 Received: 2004-10-08 Pages: 8
Assignor
KT VENTURE GROUP, L.L.C.
Executed: 2004-10-07
Assignee
BLUE29 CORPORATION
615 PALOMAR AVENUE, SUNNYVALE, CA, 94085, UNITED STATES
Covered Properties (16)
Universal Substrate Holder for Treating Objects in Fluids
Multi-staged heating system for fabricating microelectronic devices
Application: 10/624,397 →
Methods and System for Processing a Microelectronic Topography
Application: 10/462,167 →
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
Application: 10/462,343 →
Microelectronic Fabrication System Components and Method for Processing a Wafer Using Such Components
Application: 10/462,180 →
Method for Electroless Deposition of Phosphorus-Containing Metal Films Onto Copper with Palladium-Free Activation
Application: 10/345,134 →
Activation-Free Electroless Solution for Deposition of Cobalt and Method for Deposition of Cobalt Capping/Passivation Layer on Copper
Application: 10/379,692 →
Universal Substrate Holder for Treating Objects in Fluids
Application: 10/369,878 →
Solution Composition and Method for Electroless Deposition of Coatings Free of Alkali Metals
Application: 10/339,260 →
Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
Application: 10/299,070 →
Spatially-Arranged Chemical Processing Station
Application: 10/299,069 →
Method and apparatus for uniform treatment of objects in liquids
Application: 10/299,074 →
Temperature-Controlled Substrate Holder for Processing in Fluids
Application: 10/247,895 →
Method and Apparatus for Electroless Deposition with Temperature-Controlled Chuck
Application: 10/242,331 →
Alkaline metal-free solution for electroless deposition of Co(W,P) barrier/capping layer for interconnect applications
Application: 60/401,948 →
Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates
Application: 10/103,015 →