Microelectronic fabrication system components and method for processing a wafer using such components
View Patent ↗A process chamber is provided which includes a gate configured to align barriers with an opening of the gate and an opening of the process chamber such that the two openings are either sealed or provide an air passage to the chamber. A method is provided and includes sealing an opening of a chamber with a gate latch and exposing a topography to a first set of process steps, opening the gate latch such that an air passage is provided to the process chamber, and exposing the topography to a second set of process steps without allowing liquids within the chamber to flow through the air passage. A substrate holder comprising a clamping jaw with a lever and a support member coupled to the lever is also contemplated herein. A process chamber with a reservoir arranged above a substrate holder is also provided herein.
1. A process chamber, comprising:
a substrate holder; and
a reservoir arranged above the substrate holder and within sidewalls of the process chamber, wherein the process chamber is adapted to move the reservoir proximate to the substrate holder, wherein the reservoir comprises a hatch, and wherein the process chamber is adapted to uncouple the hatch from the reservoir and rotate the hatch within the reservoir.
2. The process chamber of claim 1 , wherein the reservoir is adapted to hold one or more fluids for processing a microelectronic topography.
3. The process chamber of claim 2 , wherein the reservoir is adapted to hold one or more single-phase fluids.
4. The process chamber of claim 2 , further adapted to replenish the fluids within the reservoir.
5. The process chamber of claim 1 , wherein the reservoir comprises one or more valves, and wherein the process chamber is adapted to open the valves upon moving the reservoir proximate to the substrate holder.
6. A process chamber, comprising:
a wall with an opening;
a first fixed barrier spaced in proximity to and in alignment with the wall opening;
a casing coupled to the wall and configured to form an enclosure about the wall opening, wherein the casing comprises an opening laterally adjacent to the wall opening; and
a second fixed barrier spaced in proximity to and in alignment with the casing opening.
7. The process chamber of claim 1 , wherein the first fixed barrier is spaced in proximity to the wall opening along the side of the wall interior to the process chamber.
8. The process chamber of claim 7 , wherein the second fixed barrier is further spaced in proximity to the wall opening along the side of the wall exterior to tho process chamber.
9. The process chamber of claim 6 , wherein the first and second fixed barriers prevent fluids within the process chamber from flowing through the wall opening and the casing opening.
10. The process chamber of claim 6 , wherein the process chamber is adapted to draw air through the casing opening and the wall opening into the process chamber.
11. A semiconductor precess chamber, comprising:
a substrate holder; and
a reservoir arranged within sidewalls of the process chamber, wherein the process chamber is adapted to move the reservoir closer to and farther away from the substrate holder, wherein the reservoir comprises a hatch, and wherein the process chamber is configured to uncouple the hatch from a side of the reservoir and move the hatch within the reservoir.
12. The semiconductor process chamber of claim 11 , wherein the process chamber is configured to position the hatch midway within the reservoir.
13. The semiconductor process chamber of claim 11 , wherein the process chamber is configured to rotate the hatch within the reservoir.
14. The semiconductor process chamber of claim 11 , wherein the hatch comprises a length substantially similar to or greater than the diameter of a wafer processed in the semiconductor process chamber.
15. A process chamber comprising:
a substrate holder; and
a reservoir arranged within sidewalls of the process chamber, wherein the process chamber is adapted to position the reservoir in contact with the substrate holder.
16. The process chamber of claim 15 , wherein the reservoir comprises a hatch, and wherein the process chamber is configured to move the hatch subsequent to positioning the reservoir in contact with the substrate holder.
17. The process chamber of claim 15 , wherein the hatch comprises one or more valves, and wherein the process chamber is configured to open the valves subsequent to positioning the reservoir in contact with the substrate holder.