Patent Assignment
Reel/Frame 018323/0734
Security Agreement
Recorded: 2006-10-02
Received: 2006-10-02
Pages: 20
Assignor
BLUE 29, LLC
Executed: 2006-09-11
Assignee
KLA-TENCOR CORPORATION
160 RIO ROBLES, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(31)
Systems Incorporating Microwave Heaters Within Fluid Supply Lines of Substrate Processing Chambers and Methods for Use of Such Systems
Application:
11/536,429 →
Semiconductor System with Surface Modification
Application:
60/804,425 →
Non-Corrosive Chemical Rinse System
Application:
11/276,728 →
Electroless deposition system eliminating strongly bonding species
Application:
60/740,133 →
Electroless Plating System
Application:
60/596,717 →
Non-Corrosive Chemical Rinse System
Application:
60/596,716 →
Spatially-arranged chemical processing station
Application:
11/217,750 →
Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom
Application:
11/199,620 →
Systems and Methods Affecting Profiles of Solutions Dispensed Across Microelectronic Topographies During Electroless Plating Processes
Application:
11/200,324 →
Apparatus Configurations for Affecting Movement of Fluids Within a Microelectronic Topography Processing Chamber
Application:
11/199,657 →
Barrier Layer Configurations and Methods for Processing Microelectronic Topographies Having Barrier Layers
Application:
11/199,621 →
Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates
Application:
11/138,531 →
Methods and Systems for Processing a Microelectronic Topography
Application:
11/108,589 →
Methods and Systems for Processing a Microelectronic Topography
Application:
11/102,143 →
Microelectronic Fabrication System Components and Method for Processing a Wafer Using Such Components
Application:
11/034,363 →
Method and Apparatus for Transistor Sidewall Salicidation
Application:
10/989,911 →
Nano-Electrode-Array for Integrated Circuit Interconnects
Application:
10/990,273 →
Multi-staged heating system for fabricating microelectronic devices
Application:
10/624,397 →
Methods and System for Processing a Microelectronic Topography
Application:
10/462,167 →
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
Application:
10/462,343 →
Microelectronic Fabrication System Components and Method for Processing a Wafer Using Such Components
Application:
10/462,180 →
Method for Electroless Deposition of Phosphorus-Containing Metal Films Onto Copper with Palladium-Free Activation
Application:
10/345,134 →
Activation-Free Electroless Solution for Deposition of Cobalt and Method for Deposition of Cobalt Capping/Passivation Layer on Copper
Application:
10/379,692 →
Universal Substrate Holder for Treating Objects in Fluids
Application:
10/369,878 →
Solution Composition and Method for Electroless Deposition of Coatings Free of Alkali Metals
Application:
10/339,260 →
Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
Application:
10/299,070 →
Spatially-Arranged Chemical Processing Station
Application:
10/299,069 →
Method and apparatus for uniform treatment of objects in liquids
Application:
10/299,074 →
Temperature-Controlled Substrate Holder for Processing in Fluids
Application:
10/247,895 →
Method and Apparatus for Electroless Deposition with Temperature-Controlled Chuck
Application:
10/242,331 →
Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates
Application:
10/103,015 →