IP Library › Assignment 014908/0748
Patent Assignment
Reel/Frame 014908/0748

Assignment of Assignor's Interest

Recorded: 2004-01-22 Pages: 2
Assignor
ODA, NORIAKI
Executed: 2004-01-15
Assignee
NEC ELECTRONICS
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device with Bonding Pad Support Structure
Patent: 7,397,125 →
Application: 10/761,204 →
Publication: US 2004/0150112
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Record to Correct Assignee's Name on an Assignment Previously Recorded at Reel 014908, Frame 0748 Nov 10, 2004
From: ODA, NORIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 015365/0387 →
Change of Name Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0136 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →