Patent Assignment
Reel/Frame 015365/0387
Record to Correct Assignee's Name on an Assignment Previously Recorded at Reel 014908, Frame 0748
Recorded: 2004-11-10
Pages: 3
Assignor
ODA, NORIAKI
Executed: 2004-01-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device with Bonding Pad Support Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 2004
From: ODA, NORIAKI
To: NEC ELECTRONICS
Reel/Frame 014908/0748 →
Change of Name
Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0136 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →