IP Library › Assignment 014916/0234
Patent Assignment
Reel/Frame 014916/0234

Assignment of Assignor's Interest

Recorded: 2004-01-26 Pages: 3
Assignor
LEE, JAE SUK
Executed: 2003-12-29
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property (1)
Methods for Forming Shallow Trench Isolation Structures
Patent: 7,018,907 →
Application: 10/748,468 →
Publication: US 2004/0152280
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name May 30, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017703/0499 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017703 Frame 0499. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 28, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017854/0297 →