IP Library Assignment 014997/0623
Patent Assignment
Reel/Frame 014997/0623

Assignment of Assignor's Interest

Recorded: 2003-09-17 Pages: 3
Assignors
CZECZKA, REGINA
Executed: 2003-09-06
STAMP, LUTZ
Executed: 2003-09-05
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, 10553, BERLIN, GERMANY
Covered Property (1)
Direct Electrolytic Metallization on Non-Conducting Substrates
Patent: 7,025,867 →
Application: 10/472,374 →
Publication: US 2004/0112755
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Security Interest Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →