IP Library Assignment 015054/0487
Patent Assignment
Reel/Frame 015054/0487

Assignment of Assignor's Interest

Recorded: 2004-03-02 Pages: 6
Assignors
THOMAS, JOCHEN
Executed: 2004-02-16
WEITZ, PETER
Executed: 2004-02-27
GRAFE, JURGEN
Executed: 2004-02-18
HEDLER, HARRY
Executed: 2004-02-16
POHL, JENS
Executed: 2004-02-12
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Integrated Circuit with Re-Route Layer and Stacked Die Assembly
Patent: 7,422,930 →
Application: 10/790,907 →
Publication: US 2005/0194674
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 28, 2009
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023437/0743 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →