Patent Assignment
Reel/Frame 023437/0743
Assignment of Assignor's Interest
Recorded: 2009-10-28
Pages: 3
Assignor
INFINEON TECHNOLOGIES AG
Executed: 2008-05-28
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property
(1)
Integrated Circuit with Re-Route Layer and Stacked Die Assembly
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 2, 2004
From: THOMAS, JOCHEN; WEITZ, PETER; GRAFE, JURGEN; HEDLER, HARRY
To: INFINEON TECHNOLOGIES AG
Reel/Frame 015054/0487 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →