IP Library Assignment 015154/0924
Patent Assignment
Reel/Frame 015154/0924

Assignment of Assignor's Interest

Recorded: 2004-09-21 Pages: 3
Assignors
REISS, MARTIN
Executed: 2004-06-11
HAIMERL, ALFRED
Executed: 2004-06-12
KROEHNERT, STEFFEN
Executed: 2004-06-11
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, 81669 MUNICH, GERMANY
Covered Property (1)
Substrate-Based Chip Package
Patent: 6,949,820 →
Application: 10/859,459 →
Publication: US 2005/0006741
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023821/0535 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Oct 16, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036877/0513 →