IP Library Assignment 015217/0267
Patent Assignment
Reel/Frame 015217/0267

Assignment of Assignor's Interest

Recorded: 2004-04-15 Pages: 3
Assignors
AIBA, AKIHIRO
Executed: 2003-11-07
OKABE, TAKEO
Executed: 2003-11-13
Assignee
NIKKO MATERIALS COMPANY, LIMITED
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO 105-8407, JAPAN
Covered Property (1)
Electrolytic Copper Plating Method, Phosphorus-Containing Anode for Electrolytic Copper Plating, and Semiconductor Wafer Plated Using Them and Having Few Particles Adhering to It
Patent: 7,374,651 →
Application: 10/478,750 →
Publication: US 2004/0149588
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 28, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018555/0221 →
Change of Name/Merger Jun 9, 2011
From: NIPPON MINING & METALS CO., LTD.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026417/0023 →
Change of Address Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →