Patent Assignment
Reel/Frame 015374/0777
Assignment of Assignor's Interest
Recorded: 2004-11-18
Pages: 4
Assignors
CHOW, SENG GUAN
Executed: 2004-08-25
YING, MING
Executed: 2004-08-25
SHIM, IL KWON
Executed: 2004-08-25
EMIGH, ROGER
Executed: 2004-08-27
Assignee
STATS CHIPPAC LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Stacked Die Packaging and Fabrication Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →